With the development of new energy vehicles and the electronic industry, the working speed of electronic components is increasing day by day, and correspondingly, the heat generated by them is also increasing. In order to enable electronic components to operate at high speed, it is necessary to discharge the heat generated by them as soon as possible, otherwise the electronic components will not work properly, and may even be burned by high temperatures. Currently, the commonly used heat dissipation method is to install a heat dissipation module on the heating electronic components. The heat dissipation module generally includes multiple heat dissipation fins and heat pipes running through these heat dissipation fins. The heat pipes transfer the heat generated by the electronic components to the heat dissipation springs, and heat is dissipated by the heat exchange between the large area of the heat dissipation fins and the external air. Thermal modules are mainly used in servers, commu…
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